Advanced Concepts for Intelligent Vision Systems
Sept. 24-27, 2018
Espace Mendes France, Poitiers, France
Deadline extended. The new paper submission deadline is May 18, 2018.
Acivs 2018 is a conference focusing on techniques for building adaptive, intelligent, safe and secure imaging systems. Acivs 2018 consists of four days of lecture sessions, both regular (25 minutes) and invited presentations, and poster sessions. The proceedings of Acivs 2018 will be published by Springer in the Lecture Notes in Computer Science series and are listed in the ISI proceedings index. Official Springer records show that the conference reaches a wide audience: the proceedings convering the period 2005-2016 have been donwloaded over half a million times already.
A special issue of the international journal Integrated Computer-Aided Engineering will be devoted to a selected number of extended and updated versions of the most interesting/innovative papers presented at the Acivs 2018 conference. The submitted journal paper must have at least 1/3 of new or changed content.
Acivs 2018 will also feature several social activities (included in the registration fee), including an opening reception, a conference dinner and a cultural acivitity. In addtion Acivs 2018 will be organized at the same date and place as the ICFSP conference, and will provide a good opportunity to attend both events.
The conference fee includes the social program (conference dinner, opening reception, and cultural activities), coffee breaks, daily lunches and a copy of the proceedings. The registration fees (including VAT) are 250€ for students, 400€ for IEEE members and 450€ for all other participants). In addition, registration to ACIVS grants a free admission to the ICFSP conference.
Invited speakersAcivs 2018 will feature several invited talks, to be announded later.
- Image and Video Processing: preprocessing (scanning, sampling, quantization, …), compressed sensing, filtering, restoration and enhancement, color processing; including applications like multi-camera systems and sensor networks.
- Multidimensional Image Processing: optical, infrared, radar, sonar, polarimetric, multispectral, hyperspectral and other types of images and videos; including applications like remote sensing and medical applications.
- Image and Video Analysis: segmentation, computational photography, tracking, pattern analysis, computer vision, early and biologically inspired vision, information geometry, image and video databases, search and retrieval, multimodality, authentication and watermarking; including applications like events supervision, surveillance applications, biometrics and forensics, robotics, vision-based guidance and navigation.
- Image and Video Coding: coding, quality metrics, image and video protection; including applications like multimedia applications, mobile imaging, augmented reality.
Both classical research papers and application papers are welcome.
The conference will take place in Espace Mendes France, Poitiers, France on Sept. 24-27, 2018.
Prospective authors should prepare a full paper and submit it electronically. The paper should consist of 8-12 pages in A4 format and should conform to the style guidelines outlined on the Acivs 2018 website.
Papers should be submitted in LaTeX format or MsWord format. However the use of MSWord is strongly discouraged since MSWord documents, especially those containing equations, often suffer from poor typesetting.
LaTeX style sheets, MSWord templates and
more detailed information
on the submission process can be found on the Acivs 2018 website (http://acivs.org/acivs2018/).
It is absolutely essential that submitted papers are based on the provided templates. Accepted papers which do not satisfy the requirements or which cannot be processed without changes will be returned to the authors and may
not be published.
All submissions will be reviewed by at least 2 members of the Program Committee; additional reviewers will be consulted if needed. The papers should provide sufficient background information and should clearly indicate the original contribution. They should state and discuss the main results and provide adequate references. Paper submission implies that one of the authors will present the paper if it is accepted. Duplicate submissions to other conferences, or modified copies of earlier papers are not acceptable.
Submission implies the authors have obtained all IP clearance from their employers, eg. the submitted material contains nothing that is commercial-in-confidence.
The proceedings of Acivs 2018 will be published by Springer in the Lecture Notes in Computer Science series. LNCS is published, in parallel to the printed books, in full-text electronic form via Springer's internet platform (http://www.springerlink.com).
|May 18, 2018||Full paper submission|
|July 7, 2018||Notification of acceptance|
|July 21, 2018||Camera-ready papers due|
|August 10, 2018||Registration deadline for authors of accepted papers|
|August 15, 2018||Early registration deadline|
|Sept. 24-27, 2018||Acivs 2018|
Pascal Bourdon, XLIM, Poitiers, France.
David Helbert, University of Poitiers, Poitiers, France.
Mohamed-Chaker Larabi, XLIM, Poitiers, France.
François Lecellier, XLIM, Poitiers, France.
Benoit Tremblais, XLIM, Poitiers, France.
Thierry Urruty, XLIM, Poitiers, France.
Jacques Blanc-Talon, DGA, Paris, France.
David Helbert, University of Poitiers, Poitiers, France.
Wilfried Philips, Ghent University - imec, Ghent, Belgium.
Dan Popescu, CSIRO Data 61, Canberra, Australia.
Paul Scheunders, University of Antwerp, Antwerp, Belgium.
Hojjat Adeli, Ohio State University, Columbus, USA.
Syed Afaq Shah, The University of Western Australia, Perth, Australia.
Hamid Aghajan, Ghent University - imec, Ghent, Belgium.
Edoardo Ardizzone, University of Palermo, Palermo, Italy.
Antonis Argyros, University of Crete, Heraklion, Greece.
George Bebis, University of Nevada, Reno, USA.
Fabio Bellavia, University of Florence, Florence, Italy.
Jenny Benois-Pineau, University of Bordeaux, Bordeaux, France.
Dominique Béréziat, Université Pierre et Marie Curie, Paris, France.
Yannick Berthoumieu, Bordeaux INP, Bordeaux, France.
Janus Bobulski, Czestochowa University of Technology, Częstochowa, Poland.
Philippe Bolon, University of Savoie, Annecy, France.
Egor Bondarev, Technische Universiteit Eindhoven, Eindhoven, the Netherlands.
Don Bone, University of Technology Sydney, Sydney, Australia.
Adrian Bors, University of York, York, UK.
Salah Bourennane, Ecole Centrale de Marseille, Marseille, France.
Catarina Brites, Instituto Superior Técnico, Lisboa, Portugal.
Vittoria Bruni, University of Rome La Sapienza, Roma, Italy.
Dumitru Burdescu, University of Craiova, Craiova, Romania.
Tiago J. Carvalho, Instituto Federal de São Paulo - Campinas, Campinas - SP, Brazil.
Giuseppe Cattaneo, University of Salerno, Fisciano, Italy.
Jocelyn Chanussot, Université de Grenoble Alpes, Grenoble, France.
Kacem Chehdi, ENSSAT, Rennes, France.
Gianluigi Ciocca, University of Milano Bicocca, Milano, Italy.
Eric Debreuve, CNRS, Sophia Antipolis, France.
Patrick Delmas, The University of Auckland, Auckland, New-Zealand.
Stéphane Derrode, Ecole Centrale de Lyon, Lyon, France.
Nicolas Dobigeon, ENSEEIHT, Toulouse, France.
Jérôme Gilles, San Diego State University, San Diego, USA.
Daniele Giusto, Università degli Studi di Cagliari, Cagliari, Italy.
Bart Goossens, Ghent University - imec, Ghent, Belgium.
Philippe Gosselin, ENSEA, Cergy, France.
Artyom Grigoryan, UTSA, San Antonio, USA.
Christine Guillemot, INRIA, Rennes Cedex, France.
Jon Yngve Hardeberg, Norwegian University of Science and Technology, Gjøvik, Norway.
Gloria Haro, Universitat Pompeu Fabra, Barcelona, Spain.
Monson Hayes, George Mason University, Fairfax, USA.
Lionel Heng, DSO National Laboratories, Singapore, Singapore.
Michael Hild, Osaka Electro-Communication University, Neyagawa, Japan.
Mark Holden, Kyoto University, Kyoto, Japan.
Kazuhiro Hotta, Meijo University, Nagoya, Japan.
Dimitris Iakovidis, University of Thessaly, Lamia, Greece.
Syed Islam, Edith Cowan University, Australia.
Yuji Iwahori, Chubu University, Kasugai, Japan.
Graeme Jones, Kingston University, Kingston upon Thames, UK.
Arto Kaarna, Lappeenranta University of Technology, Lappeenranta, Finland.
Robert Koprowski, University of Silesia, Katowice, Poland.
Bogdan Kwolek, AGH University of Science and Technology, Krakow, Poland.
Kenneth Lam, The Hong Kong Polytechnic University, Hong Kong, China.
Patrick Lambert, Polytech' Savoie, Annecy-le-vieux, France.
Sébastien Lefèvre, Université Bretagne Sud, Vannes, France.
Ludovic Macaire, Université Lille 1 Sciences et Technologies, Villeneuve d'Ascq, France.
Antoine Manzanera, ENSTA ParisTech, Palaiseau, France.
Gonzalo Pajares Martinsanz, Universidad Complutense, Madrid, Spain.
Fabrice Mériaudeau, Universiti Teknologi PETRONAS, Seri Iskandar, Malaysia.
Massimo Minervini, IMT School for Advanced Studies, Lucca, Italy.
Amar Mitiche, INRS, Montréal, Canada.
Thomas Moeslund, Aalborg University DK, Aalborg, Denmark.
David Monnin, French-German Research Institute of Saint-Louis, Saint-Louis, France.
Adrian Munteanu, Vrije Universiteit Brussel, Brussels, Belgium.
Maria Navascuès, Universidad de Zaragoza, Zaragoza, Spain.
António J. R. Neves, University of Aveiro, Aveiro, Portugal.
Jennifer Newman, Iowa State University, Ames, USA.
Vincent Nozick, Université Paris-Est Marne-la-Vallée, Noisy-le-grand, France.
Danielle Nuzillard, Université de Reims Champagne-Ardenne, Reims, France.
Rudi Penne, University of Antwerp, Antwerp, Belgium.
Fernando Pérez-González, University of Vigo, Vigo, Spain.
Caroline Petitjean, Université de Rouen, Rouen, France.
Hossein Rahmani, Lancaster University, Lancaster, UK.
Giovanni Ramponi, University of Trieste, Trieste, Italy.
Florent Retraint, Université de Technologie de Troyes, Troyes, France.
Patrice Rondao Alface, Nokia Bell Labs, Antwerpen, Belgium.
Florence Rossant, ISEP, Paris, France.
Luis Salgado, Universidad Politécnica, Madrid, Spain.
Nel Samama, Télécom Sud-Paris, Evry, France.
Ivan Selesnick, New-York University, Brooklyn, USA.
Wladyslaw Skarbek, University of Technology, Warsaw, Poland.
Andrzej Sluzek, Khalifa University, Abu Dhabi, United Arab Emirates.
Ferdous Sohel, Murdoch University, Murdoch, Australia.
Changming Sun, CSIRO, Sydney, Australia.
Hugues Talbot, Université Paris-Est - ESIEE, Noisy-le-Grand, France.
Attila Tanács, University of Szeged, Szeged, Hungary.
Yuliya Tarabalka, INRIA, Sophia-Antipolis, France.
Nadège Thirion-Moreau, SeaTech - Université de Toulon, Toulon, France.
Sylvie Treuillet, Université d'Orléans, Orléans, France.
Florence Tupin, Télécom ParisTech, Université Paris Saclay, Saclay, France.
Cesare Valenti, Università di Palermo, Palermo, Italy.
Marc Van Droogenbroeck, University of Liège, Liège, Belgium.
Pascal Vasseur, LITIS - Université de Rouen Normandie, Rouen, France.
Peter Veelaert, Ghent University - imec, Ghent, Belgium.
Sergio Velastin, Queen Mary University of London, London, UK.
Nicole Vincent, Université Paris Descartes, Paris, France.
Domenico Vitulano, National Research Council, Roma, Italy.
Damien Vivet, ISAE-SUPAERO, Toulouse, France.
Shin Yoshizawa, RIKEN, Saitama, Japan.
Gerald Zauner, Fachhochschule Ober Osterreich, Wels, Austria.
Pavel Zemcik, Brno University of Technology, Brno, Czech Republic.
Josiane Zérubia, INRIA, Sophia-Antipolis, France.
Djemel Ziou, Sherbrooke University, Sherbrooke, Canada.
This conference is listed on conference-service.com.
This conference is listed on Isaac Scientific Publishing, Journal of Circuits and Systems.